发明名称 CERAMIC CIRCUIT BOARD AND POWER SEMICONDUCTOR MODULE USING IT
摘要 PROBLEM TO BE SOLVED: To prevent any crack of a ceramic circuit board with an extrusion portion, to improve flexural strength, and to prevent short circuit and the like. SOLUTION: In the ceramic circuit board in which circuit patterns comprising a metal plate are formed by forming a wax material layer along a plurality of circuit patterns in at least one surface of the ceramic circuit board, jointing the metal plate through the wax material layer, and etching the garbage of the metal plate, and an extrusion portion by the wax material layer protruded from a felly of the metal plate is formed, the maximum surface roughness Rmax of the extrusion portion is 5-50μm. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005268821(A) 申请公布日期 2005.09.29
申请号 JP20050150960 申请日期 2005.05.24
申请人 HITACHI METALS LTD 发明人 IMAMURA TOSHIYUKI;WATANABE JUNICHI
分类号 H05K1/02;H01L23/14;H05K1/03;H05K3/38;(IPC1-7):H05K3/38 主分类号 H05K1/02
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