| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having adhesion to lead frame high enough to prevent the release from the lead frame in soldering treatment and being excellent in soldering resistance and to provide a semiconductor device. SOLUTION: The epoxy resin composition for semiconductor sealing comprises (A) an epoxy resin, (B) a phenolic resin, (C) a cure accelerator, (D) an inorganic filler, (E) an aromatic carboxylic acid, and (F) a thiophene compound. The semiconductor is prepared by sealing a semiconductor element with the same. COPYRIGHT: (C)2005,JPO&NCIPI
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