| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having high adhesion strength to a lead frame and excellent solder resistance, and to provide a semiconductor device. SOLUTION: The epoxy resin composition for sealing a semiconductor contains (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler, and (E) a basic compound according to Lewis's definition having a ratio C/E of C to E of≥3 which is a parameter by Drago. The semiconductor device is given by sealing a semiconductor element with the aid of the epoxy resin composition. COPYRIGHT: (C)2005,JPO&NCIPI
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