SUBSTRATE FOR MOUNTING, AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To improve precision of mounting in a flip-chip pattern on a substrate. SOLUTION: On this surface mount substrate, a mount component 12 arranged at a prescribed position on the side of a mount surface and having a plurality of bump electrodes 14 conical toward their tips is surface-mounted in a face-down pattern in particular. The surface mount substrate is provided with a substrate body 9 having a plurality of conductive bumps 11 which are provided at positions corresponding to each of the plurality of bump electrodes 14 of the mount component 12, and which are connected electrically and mechanically with each of the plurality of bump electrodes 14. Each of the plurality of bumps 11 of the substrate body 9 has a peripheral wall 15 projecting to the side of the mount part 12 so as to decide the connecting areas of the bump electrodes 14. COPYRIGHT: (C)2005,JPO&NCIPI