| 摘要 |
PROBLEM TO BE SOLVED: To propose an improved packaging structure for a capacitor that can easily alleviate stress applied to an outgoing lead and prevent the outgoing lead from being broken when its ambient temperature changes, it is soldered, or even when it is vibrated. SOLUTION: An external holding object is prepared outside of a resin case housing a capacitor covered by a filler, and an internal holding object is also prepared. The external holding object has an upper external wall that is adhered to the upper resin wall of the resin case. The resin case and the bottom opening of the external holding object overlap each other, thus forming a bottom space. In the bottom space, the outgoing lead is arranged. COPYRIGHT: (C)2005,JPO&NCIPI
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