APPARATUS FOR SEALING WITH RESIN

摘要

PROBLEM TO BE SOLVED: To provide an apparatus for sealing with resin of efficiently carrying out sealing with resin of a highly-concentrated package formed on a substrate by simplifying a mold structure and a maintenance of the mold. SOLUTION: A cavity hole 17 is filled with resin for sealing via a resin supply path 38 formed between a mold surface 36 and the plate surface 44 of a cavity plate 1 using a pot 34 provided in a mold. COPYRIGHT: (C)2005,JPO&NCIPI