| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper-clad laminated film which is suitable for a material for a flexible circuit board capable of ensuring an enough adhesive force durable to a practical use before and after heat treatment in thinking about conventional technologies. SOLUTION: A metal laminated film in which the first metal layer, the second metal layer, and a copper layer are laminated in this order on an organic film layer, is characterized in that after heat treatment in an open air at 150°C for 168 h, when peeling is performed from an interface between the first metal layer and the organic film layer, the maximum value of the concentration of the second metal layer constituting elements included in a region to a depth of 4 nm toward the second metal layer side from the released interface of the first metal layer is≤10 atomic%. COPYRIGHT: (C)2005,JPO&NCIPI
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