发明名称 |
Ceramic packaging for high brightness LED devices |
摘要 |
Embodiments of the present invention include a light emitting diode package comprising a ceramic cavity comprising a substrate for mounting a light emitting diode and substantially vertical sidewalls for reducing light leakage. The ceramic LED package further includes a metallic coating on a portion of the ceramic substrate for reflecting light in a predetermined direction.
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申请公布号 |
US2005213334(A1) |
申请公布日期 |
2005.09.29 |
申请号 |
US20040812526 |
申请日期 |
2004.03.29 |
申请人 |
LEE KONG W;NG KEE Y;LEE MENG E;LEE KIAN S;CHUA JANET B Y |
发明人 |
LEE KONG W.;NG KEE Y.;LEE MENG E.;LEE KIAN S.;CHUA JANET B.Y. |
分类号 |
F21V7/00;H01L33/48;H01L33/60;(IPC1-7):F21V7/00 |
主分类号 |
F21V7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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