Device for exposing a photosensitive resist layer on a semiconductor wafer during manufacture of a semiconductor memory comprises a light source, an illuminator geometry, a hybrid mask, and a projection lens

摘要

#CMT# #/CMT# Projection exposing device for exposing a photosensitive resist layer (6) on a semiconductor wafer (7) during manufacture of a semiconductor memory comprises a light source (1), an illuminator geometry (3) with a rectangular opening, a hybrid mask (4) for the semiconductor memory consisting of an alternating phase mask with a phase difference of adjacent light structures of 180[deg] for establishing construction element structures of the cell field region and a chromium structure mask for establishing construction element structures of the logic region on the semiconductor wafer, and a projection lens (5). #CMT# : #/CMT# Independent claims are also included for: (1) Hybrid mask; (2) Illuminator geometry; and (3) Process for exposing a photosensitive resist layer on a semiconductor wafer during manufacture of a semiconductor memory. #CMT#USE : #/CMT# For exposing a photosensitive resist layer on a semiconductor wafer during manufacture of a semiconductor memory. #CMT#ADVANTAGE : #/CMT# The device is cost-effective and has good resolution and a low MEF factor. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a schematic view of the device. 1 : light source 3 : illuminator geometry 4 : hybrid mask 5 : projection lens 6 : photosensitive resist layer 7 : semiconductor wafer.