发明名称 CURABLE LIQUID RESIN COMPOSITION
摘要 <p>The invention relates to a curable liquid resin composition comprising the following components (A), (B), and (C): 0.5-50 wt% of a urethane (meth)acrylate oligomer obtained from a polyol (a) having a branched structure comprising at least one branch point and at least three molecular chains extending from that branch point, said molecular chains having a molecular weight of 200 g/mol or more, including a hydroxyl group at the terminal of at least two molecular chains extending from the branch point, a polyisocyanate (b), and a hydroxyl group-containing (meth)acrylate (c); (B) 5-90 wt% of a polymerizable organic compound; and (C) 0.1-10 wt% of a polymerization initiator, wherein the cured product has a Young's modulus of 350 MPa or more at 23&lt;°&gt;C.</p>
申请公布号 WO2005090488(A1) 申请公布日期 2005.09.29
申请号 WO2005NL00220 申请日期 2005.03.23
申请人 DSM IP ASSETS B.V.;JSR CORPORATION;SUGIMOTO, MASANOBU;SHIGEMOTO, TAKEO;KOMIYA, ZEN;BUIJSEN, PAULUS, FRANCISCUS, ANNA;STEELMAN, PAULUS, ANTONIUS, MARIA 发明人 SUGIMOTO, MASANOBU;SHIGEMOTO, TAKEO;KOMIYA, ZEN;BUIJSEN, PAULUS, FRANCISCUS, ANNA;STEELMAN, PAULUS, ANTONIUS, MARIA
分类号 C09D4/00;C08F290/06;C09D4/06;(IPC1-7):C09D4/00 主分类号 C09D4/00
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