Method of forming solder mask

摘要

The invention relates to a method of forming a solder mask on a printed circuit board using a powder paint composition, which method comprises the steps of
<DefinitionList compact="compact" id="dla01"><DefinedTerm>a</DefinedTerm><DefinitionDescription>charging powder paint particles in the presence of carrier particles</DefinitionDescription><DefinedTerm>b</DefinedTerm><DefinitionDescription>feeding the charged powder paint particles with carrier particles to a transporter</DefinitionDescription><DefinedTerm>c</DefinedTerm><DefinitionDescription>optionally transferring the charged powder paint particles from the transporter onto a transfer medium</DefinitionDescription><DefinedTerm>d</DefinedTerm><DefinitionDescription>applying the powder paint particles to a printed circuit board to form a layer of powder paint particles</DefinitionDescription><DefinedTerm>e</DefinedTerm><DefinitionDescription>irradiating the layer by subjecting the layer to ultra violet irradiation through a pattern mask to obtain partial or full cure of the exposed powder paint particles</DefinitionDescription><DefinedTerm>f</DefinedTerm><DefinitionDescription>developing the layer with a medium which dissolves the region not irradiated by the ultraviolet rays.</DefinitionDescription></DefinitionList>