发明名称 Multilayer ceramic substrate and its production method
摘要 <p>An object of the invention is to connect different dielectrics electrically to each other in the direction of main surface of a sheet in a multilayer ceramic substrate and to increase the degree of flexibility in design and make the multilayer ceramic substrate compact in size. A multilayer ceramic substrate in accordance with the invention is formed of a plurality of laminated ceramic substrates including such a composite ceramic substrate of different materials that is made by inserting the second ceramic substrate (6) in a pounched-out portion made in the first ceramic substrate (1) and by planarizing its top and bottom surfaces, wherein a conductive layer (11) is formed in a portion across a boundary between the first ceramic substrate and the second ceramic substrate of the interface of the composite ceramic substrate of different materials.</p>
申请公布号 EP1581035(A2) 申请公布日期 2005.09.28
申请号 EP20050003439 申请日期 2005.02.17
申请人 TDK CORPORATION 发明人 HATANAKA, KIYOSHI;NISHINO, HARUO;NINOMIYA, HIDEAKI
分类号 C04B35/622;C04B35/00;C04B35/495;H01G4/06;H01G4/20;H05K1/03;H05K1/09;H05K1/16;H05K3/00;H05K3/46;(IPC1-7):H05K3/46 主分类号 C04B35/622
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