发明名称 |
Multilayer ceramic substrate and its production method |
摘要 |
<p>An object of the invention is to connect different dielectrics electrically to each other in the direction of main surface of a sheet in a multilayer ceramic substrate and to increase the degree of flexibility in design and make the multilayer ceramic substrate compact in size. A multilayer ceramic substrate in accordance with the invention is formed of a plurality of laminated ceramic substrates including such a composite ceramic substrate of different materials that is made by inserting the second ceramic substrate (6) in a pounched-out portion made in the first ceramic substrate (1) and by planarizing its top and bottom surfaces, wherein a conductive layer (11) is formed in a portion across a boundary between the first ceramic substrate and the second ceramic substrate of the interface of the composite ceramic substrate of different materials.</p> |
申请公布号 |
EP1581035(A2) |
申请公布日期 |
2005.09.28 |
申请号 |
EP20050003439 |
申请日期 |
2005.02.17 |
申请人 |
TDK CORPORATION |
发明人 |
HATANAKA, KIYOSHI;NISHINO, HARUO;NINOMIYA, HIDEAKI |
分类号 |
C04B35/622;C04B35/00;C04B35/495;H01G4/06;H01G4/20;H05K1/03;H05K1/09;H05K1/16;H05K3/00;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
C04B35/622 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|