发明名称 |
METHOD OF MOUNTING A SEMICONDUCTOR CHIP, CIRCUIT BOARD FOR FLIP-CHIP CONNECTION AND METHOD OF MANUFACTURING THE SAME, ELECTROMAGNETIC WAVE READABLE DATA CARRIER AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC COMPONENT MODULE FOR AN ELECTROMAGNETIC WAVE READABLE DATA CARRIER |
摘要 |
<p>To provide a semiconductor chip mounting method by a flip-chip connection method in which a semiconductor chip can be mounted on a circuit board promptly, electrically and mechanically surely and further at a low cost, a process for pushing a melted thermoplastic resin coat aside by pressing a bump of the bare semiconductor chip on the melted thermoplastic resin coat applying an ultrasonic wave in a state in which the thermoplastic resin coat covering an electrode area on a wiring pattern is heated and melted and touching the bump and the electrode area, a process for bonding the bump and the electrode area by continuously applying an ultrasonic wave in a state in which the bump and the electrode area are touched and a process for cooling and solidifying the melted thermoplastic resin coat and bonding the body of the bare semiconductor chip on the circuit board are provided. <IMAGE></p> |
申请公布号 |
SG114482(A1) |
申请公布日期 |
2005.09.28 |
申请号 |
SG20000007658 |
申请日期 |
2000.11.23 |
申请人 |
OMRON CORPORATION |
发明人 |
WAKAHIRO KAWAI |
分类号 |
H05K1/03;H01L21/56;H01L21/60;H01L21/607;H01L23/28;H05K1/09;H05K3/06;H05K3/32;(IPC1-7):H01L21/60;H01L21/58;H01L21/44;H01L21/00;H01L23/00 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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