| 摘要 |
By securing a fatigue life of a connection portion with a semiconductor package and a mount board, a semiconductor device having a high reliability is provided. The semiconductor device consists of a semiconductor element, a mount board in which said semiconductor element is mounted, and a support member in which said mount board is supported through a connection member, wherein the connection member consists of a first mount board connection portion with the mount board at a first side of the element in a direction along a main surface of the mount board in which the semiconductor element is mounted, and consists of a first support member connection portion with the support member at a second side in opposition to the first side through the semiconductor element. |
