Method of encapsulating semiconductor devices on a printed circuit board, and a printed circuit board for use in the method

摘要

A semiconductor device is manufactured by simultaneously filling mold cavities with a fill material via a mold inlet that is partially defined through an aperture in a printed circuit board (PCB) from a first side to a second side. Manufacture of a semiconductor device comprises attaching a first semiconductor chip to a first side of a PCB. A second semiconductor chip is attached to a second side of the PCB opposite the first side of the PCB. A mold is used to form a first mold cavity which contains the first semiconductor chip over the first side of the PCB, and to form a second mold cavity which contains the second semiconductor chip over the second side of the PCB. The two mold cavities are simultaneously filled with a fill material via a mold inlet. The mold inlet is at least partially defined through an aperture in the PCB from the first side to the second side. An independent claim is also included for a PCB comprising a flat, elongate board body (101) having a first surface and an opposite second surface, and further having a first long edge and an opposite second long edge. An edge connector is located on the first long edge of the board body. First semiconductor package mounting regions are on the first surface of the board body and juxtaposed along the length of the board body between the first long edge and a second long edge. Second semiconductor package mounting regions are on the second surface of the board body and respectively aligned with the first wafer level package mounting regions. Mold inlet apertures (104) extend through the board body and located between second long edge and the semiconductor package mounting regions.