发明名称 |
SOLDERING METHOD FOR MOUNTING ELECTRIC COMPONENTS |
摘要 |
<p>A method is proposed for fastening at least one electrical component to a substrate using solder, in which elevations are produced in the solder substrate, the elevations being at least as high as the thickness of a solder layer to be produced. In another step, the solder is laid upon the elevations, and in a further step, the elevations are pressed down until they have reached approximately the height of the solder, so that a soldering procedure may follow. The method is used for producing exactly specified thicknesses of solder layers having tolerances less than 10 micrometers.</p> |
申请公布号 |
EP1309420(B1) |
申请公布日期 |
2005.09.28 |
申请号 |
EP20010956357 |
申请日期 |
2001.07.20 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
WOLF, KUNO;WALLRAUCH, ALEXANDER;MEINDERS, HORST;WILL, BARBARA;URBACH, PETER |
分类号 |
B23K3/00;B23K1/20;H01L21/52;H01L21/60;H01R43/02;H05K3/34;(IPC1-7):B23K1/20 |
主分类号 |
B23K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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