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发明名称
MULTI LAYER PRINTED CIRCUIT BOARD IN PARALLEL WITH IMPROVED INTERCONNECTION AND METHOD THEREOF
摘要
申请公布号
KR20050094291(A)
申请公布日期
2005.09.27
申请号
KR20040019470
申请日期
2004.03.22
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
LEE, KYU SANG;YANG, DEK GIN;AN, DONG GI
分类号
H05K1/11;(IPC1-7):H05K1/11
主分类号
H05K1/11
代理机构
代理人
主权项
地址
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