发明名称 |
Submount for high speed electronic devices |
摘要 |
The present invention is an electronic device including a submount for mounting a component thereon. The submount includes a first high speed transmission line electrically coupled to a contact for providing electrical contact to the component. At least two load resistors are also formed on the submount and electrically coupled to the contact. A second high speed transmission line is coupled between the two resistors to a ground electrode. The impedance and inductance of the second transmission line is desirably such as to provide a loss v. frequency characteristic that is essentially opposite to that of the first transmission line so as to produce a combined characteristic which is essentially flat.
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申请公布号 |
US6950565(B2) |
申请公布日期 |
2005.09.27 |
申请号 |
US20020265834 |
申请日期 |
2002.10.07 |
申请人 |
AGERE SYSTEMS INC |
发明人 |
FREUND JOSEPH MICHAEL;GEARY JOHN MICHAEL |
分类号 |
G02F1/01;G02F1/015;G02F1/035;(IPC1-7):G02F1/035 |
主分类号 |
G02F1/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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