| 摘要 |
A molded frame backboard assembly is disclosed including a unitary molded plastic frame and rebounding surface bonded thereto. The frame preferably is formed as one piece of plastic material having sufficient strength and rigidity to support the rebound surface and may include an internal reinforcing structure integrally molded therewith. The rebounding surface preferably is an acrylic sheet bonded at its edges to the peripheral edge of the frame. The peripheral edge of the frame is raised to support the rebounding surface such that, when attached, the rebounding surface sits flush with the peripheral edge of the frame so that the edges of the rebounding surface are not left exposed. The rebounding surface is bonded to the frame by flame treating or corona treating portions of the frame and applying an adhesive bonding material such as silicon thereto to secure the rebounding surface to the frame. A cavity is formed between the rebounding surface and the frame within the interior portion of the frame. The cavity can thereby be used for structural, design, and/or ornamental purposes.
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