发明名称 |
High density semiconductor package |
摘要 |
A high density semiconductor package comprises a substrate, a first package module and a plurality of second package modules. The substrate has a surface on which the first package module and the second package modules are disposed, wherein the second package modules surround the first package module.
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申请公布号 |
US6949826(B2) |
申请公布日期 |
2005.09.27 |
申请号 |
US20030605660 |
申请日期 |
2003.10.16 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
WANG SUNG-FEI |
分类号 |
H01L25/065;H05K1/18;(IPC1-7):H01L23/52 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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