发明名称 Power amplifier module assembly
摘要 A power amplifier module assembly ( 100 ) includes a PA module ( 102 ) having a flange ( 104 ) and a mounting bracket ( 106 ) coupled thereto. A thermally conductive pad ( 108 ) having an electrically conductive surface ( 110 ) that couples to the mounting bracket ( 106 ) and the flange ( 104 ) via a chassis ( 204 ) so as to provide both shielding and thermal dissipation to the PA module ( 102 ).
申请公布号 US6950309(B2) 申请公布日期 2005.09.27
申请号 US20040786661 申请日期 2004.02.25
申请人 MOTOROLA, INC. 发明人 PETRELLA THOMAS A.;KECK MARK A.;ODZE JENNIFER K.
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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