发明名称 |
Power amplifier module assembly |
摘要 |
A power amplifier module assembly ( 100 ) includes a PA module ( 102 ) having a flange ( 104 ) and a mounting bracket ( 106 ) coupled thereto. A thermally conductive pad ( 108 ) having an electrically conductive surface ( 110 ) that couples to the mounting bracket ( 106 ) and the flange ( 104 ) via a chassis ( 204 ) so as to provide both shielding and thermal dissipation to the PA module ( 102 ).
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申请公布号 |
US6950309(B2) |
申请公布日期 |
2005.09.27 |
申请号 |
US20040786661 |
申请日期 |
2004.02.25 |
申请人 |
MOTOROLA, INC. |
发明人 |
PETRELLA THOMAS A.;KECK MARK A.;ODZE JENNIFER K. |
分类号 |
H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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