发明名称 |
Heat sink for an optical module |
摘要 |
An optical module includes a base and a plurality of cooling fins mounted to the back surface of a printed wiring board used to support a number of opto-electronic devices. To optimize heat removal; the fins are mounted on the back surface in alignment with the opto-electronic devices mounted on the front surface. The module also includes a number of fiber-optic management features which are mounted on the wiring board or materially integrated with the base and cooling fins. By combining fiber-optic management features with a heat sink, on the opposite side of board-mounted opto-electronic components, the optical module achieves increased packaging density and functionality on a per volume basis compared with its conventional counterparts.
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申请公布号 |
US6948861(B2) |
申请公布日期 |
2005.09.27 |
申请号 |
US20010921410 |
申请日期 |
2001.08.01 |
申请人 |
SIEMENS COMMUNICATIONS, INC. |
发明人 |
NELSON ERIC;COLE GUY A.;MAKOOI BABAK B.;NEIDECLER ALBRECHT |
分类号 |
G02B6/42;G02B6/43;(IPC1-7):G02B6/36 |
主分类号 |
G02B6/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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