发明名称 |
Methods and systems for determining a thickness of a structure on a specimen and at least one additional property of the specimen |
摘要 |
Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a thickness of a structure on a specimen and at least one additional property of the specimen. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.
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申请公布号 |
US6950196(B2) |
申请公布日期 |
2005.09.27 |
申请号 |
US20010956841 |
申请日期 |
2001.09.20 |
申请人 |
KLA-TENCOR TECHNOLOGIES CORP. |
发明人 |
FIELDEN JOHN;LEVY ADY;BROWN KYLE A.;BULTMAN GARY;NIKOONAHAD MEHRDAD;WACK DAN |
分类号 |
G01N21/21;G01N21/47;G01N21/55;G01N21/63;G01N21/64;G01N21/95;G03F7/20;H01J37/317;H01L21/02;H01L21/265;H01L21/66;(IPC1-7):G01B11/28;G01N21/00 |
主分类号 |
G01N21/21 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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