| 发明名称 |
Bonding pad arrangement method for semiconductor devices |
| 摘要 |
A variety of pad arrangements are provided for semiconductor devices for reducing the likelihood of bonding failures, particularly those due to shorts, and/or for reducing the difference in length between bonding wires to decrease signal skew during operation of the semiconductor device and improve signal integrity.
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| 申请公布号 |
US6949837(B2) |
申请公布日期 |
2005.09.27 |
| 申请号 |
US20030465554 |
申请日期 |
2003.06.20 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE HO-CHEOL;KIM JAE-HOON;RYU JUNG-SU |
| 分类号 |
H01L21/60;H01L23/50;(IPC1-7):H01L23/50;H01L23/48 |
主分类号 |
H01L21/60 |
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