发明名称 Method for manufacturing a high frequency semiconductor structure and high frequency semiconductor structure
摘要 A semiconductor structure for high frequency operation has a substrate with a doped well formed therein and a buffer layer made of a substrate material covers the well. The buffer layer is made of an undoped material and is disposed on a top side of the well for inhibiting an outdiffusion of a dopant from the well. At least a portion of the substrate is not covered by the buffer layer.
申请公布号 US6949812(B2) 申请公布日期 2005.09.27
申请号 US20020253197 申请日期 2002.09.24
申请人 INFINEON TECHNOLOGIES AG 发明人 LOSEHAND REINHARD;WERTHMANN HUBERT
分类号 H01L21/331;H01L21/20;H01L21/205;H01L21/329;H01L21/822;H01L21/8222;H01L27/04;H01L27/06;H01L29/06;H01L29/732;H01L29/861;H01L29/868;H01L29/93;(IPC1-7):H01L31/075;H01L29/00;H01L21/823 主分类号 H01L21/331
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