发明名称 MOUNTED SUBSTRATE, METHOD OF FABRICATING MOUNTED SUBSTRATE, AND MOUNTED METHOD OF ELECTRONIC CIRCUIT ELEMENT
摘要 After a isolation trench is formed in a conductive foil 70, insulating resin 50 is coated on the conducting foil 70 serving as a supporting board. The conductive foil 70 is turned upside down. Using the insulating resin 50 as another supporting board, the conductive foil is ground so that it is separated into the conductive passages. Thus, the mounting board can be constructed and manufactured using necessary and minimum material. The mounting board which can prevent the conductive passages from coming off can be realized by embedding the conductive passages 51 in the insulating resin to curve the side wall of each conductive passage 51 and/or make a visor coated on the conductive passage. <IMAGE>
申请公布号 KR100516867(B1) 申请公布日期 2005.09.26
申请号 KR20010002045 申请日期 2001.01.13
申请人 发明人
分类号 H05K1/14;H01L21/48;H01L21/68;H01L23/12;H05K1/09;H05K3/04;H05K3/06;H05K3/10;H05K3/20 主分类号 H05K1/14
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