| 摘要 |
<p>PURPOSE: A method for forming a solder bump comprising a chromium under barrier metal is provided to prevent the fusion of a solder during a process for etching chromium under barrier metal. CONSTITUTION: A method for forming a solder bump comprising a chromium under barrier metal comprises the steps of: providing(110) a wafer having a protection layer for opening an electrode pad; forming(120) a chromium under barrier metal on the wafer; electroplating a solder(130); removing(140) an under barrier metal; and forming(150) a solder bump by reflowing the solder. The step of removing the under barrier metal comprises the steps of: forming a sensitive layer on the solder; removing the chromium under barrier metal by using the sensitive layer as a mask; and removing the sensitive layer.</p> |
