The flip chip bonding method using induction heating body in the AC magnetic field and the apparatus which uses the same method,申请号KR20030004005-传众专利搜索

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发明名称	The flip chip bonding method using induction heating body in the AC magnetic field and the apparatus which uses the same method
摘要
申请公布号	KR100517010(B1)	申请公布日期	2005.09.26
申请号	KR20030004005	申请日期	2003.01.21
申请人		发明人
分类号	H01L21/60;(IPC1-7):H01L21/60	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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