RESIN COMPOSITION, CURED RESIN, CURED RESIN SHEET, LAMINATE, PREPREG, ELECTRONIC PART, AND MULTILAYER SUBSTRATE

摘要

An electronic part comprising a composite dielectric layer and a conductive element portion constituting an inductive element is disclosed. The composite dielectric layer contains an organic insulating material and a dielectric ceramic powder having a relative dielectric constant higher than that of the organic insulating material. The organic insulating material contains a cured resin obtained through curing reaction between an epoxy resin and an active ester compound. The active ester compound is obtained by reacting a compound having two or more carboxyl groups with a compound having a phenolic hydroxyl group. The dielectric ceramic powder has a relative dielectric constant higher than that of the organic insulating material and the organic insulating material has a low dielectric loss tangent. Even when the electronic part is used at a high temperature not less than 100 °C for a long time, change in the relative dielectric constant with time in a high-frequency range not less than 100 MHz can be sufficiently small, thereby adequately preventing deformation of the electronic part in use.