| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming the electrode pattern of an MID substrate whose manufacturing cost is low. SOLUTION: This method for forming an electrode circuit pattern on the substrate blank surface of an MID substrate is provided to form an electrode circuit pattern 23 with conductive resin adhesive on a resin adhesion sheet 24, to semi-harden the conductive resin adhesive of the electrode circuit pattern 23, to place the resin adhesion sheet 24 formed with the electrode circuit pattern 23 on a substrate blank 22, to pressurize the resin adhesion sheet 24 formed with the electrode circuit pattern 23 by heating, to adhere it to the substrate blank 22, and to form an electrode circuit pattern 23 on the surface of the substrate blank 22. COPYRIGHT: (C)2005,JPO&NCIPI
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