发明名称 SOLID STATE IMAGING DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a solid state imaging device having a transfer electrode exhibiting excellent conductivity with high manufacturing stability. SOLUTION: The solid state imaging device comprises a section performing photoelectric conversion, and a section for transferring signal charge generated from the photoelectric converting section. The transfer section comprises a transfer electrode composed of a polysilicon film 104, and an insulating film, e.g. a silicon nitride film 102 composed of a material having a dielectric constant higher than that of a silicon oxide and covering the bottom face, the upper surface and both side faces of the transfer electrode. A silicon oxide nitride film may be employed in place of the silicon nitride film 102. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005259804(A) 申请公布日期 2005.09.22
申请号 JP20040066025 申请日期 2004.03.09
申请人 SANYO ELECTRIC CO LTD 发明人 SHIMIZU TATSU;SASADA KAZUHIRO
分类号 H01L27/148;(IPC1-7):H01L27/148 主分类号 H01L27/148
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