| 摘要 |
PROBLEM TO BE SOLVED: To more reliably form a film member with uniform thickness on a substrate by inhibiting the substrate from sagging down. SOLUTION: The film-forming apparatus is directed at forming the film member beneath an undersurface of the substrate X; and has a substrate-holding mechanism 5 for holding the ends of the substrate X while giving the ends an upward angle so that a central region of the substrate can be higher than the ends. COPYRIGHT: (C)2005,JPO&NCIPI
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