发明名称 POLYIMIDE RESIN COMPOSITION AND SEAMLESS BELT
摘要 PROBLEM TO BE SOLVED: To provide a semi-conductive polyimide resin composition whose surface resistance irregularity is small and whose resistance deterioration with the passage of time is hardly caused, and to provide its seamless belt. SOLUTION: This polyimide resin composition which comprises a polyimide resin and a conductive filler uniformly dispersed in the polyimide resin and whose volume resistivity is 1×10<SP>7</SP>(Ω×cm) to 1×10<SP>13</SP>(Ω×cm) at an applied voltage of 100 V under an environment of 25°C and a humidity of 10 %, is characterized in that an electric current-change characteristic at an applied voltage of 450 V at an arbitrary surface position of the polyimide resin composition is an approximation formula exponent part of≥-0.2 in a plot power approximating curve expression at both the logarithms of electric current-time. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005255934(A) 申请公布日期 2005.09.22
申请号 JP20040072441 申请日期 2004.03.15
申请人 NITTO DENKO CORP 发明人 KASAGI TOMOYUKI;OKAMOTO MASAYUKI
分类号 C08L79/08;C08K3/00;(IPC1-7):C08L79/08 主分类号 C08L79/08
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