发明名称 CUTTING METHOD FOR BRITTLE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a cutting method for a brittle material which can obtain a prescribed mirror surface without polishing. SOLUTION: The brittle material of a single crystal is cut by an elliptic vibration cutting method cutting the material while elliptic vibration is applied to the blade edge of a tool. By this method, even when the brittle material is calcium fluoride, since it is processed while scraps are pulled up, the thickness of the scraps and cutting force are reduced sharply, and the material can be cut efficiently in a wide ductility mode region. More specifically, the processing by a ductility mode is possible even when the thickness of cutting exceeds 85 nm. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005254516(A) 申请公布日期 2005.09.22
申请号 JP20040066398 申请日期 2004.03.09
申请人 SUMITOMO ELECTRIC HARDMETAL CORP;NEW INDUSTRY RESEARCH ORGANIZATION 发明人 KYOTANI TATSUYA;SHAMOTO EIJI;SUZUKI NORIKAZU
分类号 B23B1/00;B28D5/04;(IPC1-7):B28D5/04 主分类号 B23B1/00
代理机构 代理人
主权项
地址