Manufacturing method of semiconductor device

摘要

In a trial production process from a design process to an actual manufacturing process of semiconductor devices, a pre-process of a pad matrix wafer with simpler configuration than a prototype wafer is completed before a pre-process of the prototype wafer is completed, and data of conditions and evaluations to be used in a test process and a post-process subsequent to the pre-process of the prototype wafer is created by using the pad matrix wafer. Therefore, the data of conditions and evaluations used in the process subsequent to the pre-process can be prepared and the design modifications of various devices used in the process subsequent to the pre-process can be finished before the post-process of the prototype wafer is started. Therefore, a smooth transition from the pre-process to the subsequent processes of the prototype can be achieved, and the delivery time of semiconductor devices can be shortened.