| 摘要 |
<P>PROBLEM TO BE SOLVED: To produce high precision, uniform, and stable CSP in a good yield through effective and short time plating to form a post bump and to reduce a production space. <P>SOLUTION: Many string-shaped flows 10 of a plating solution are injected continuously into each cylindrical aperture 7 from each fine hole 18, while a disk-shaped plating solution injecting member 17 including many fine holes 18 is rotated around the vertical center line from the lower side of a wafer 1 where an external terminal 6 is exposed in the internal deep area of the cylindrical aperture 7, and the injected plating solution 10 is caused to flow into each aperture 7 through a plating solution layer 11 before overflowing from a plating treatment chamber 9 and to hit the external terminal part 6. The plating solution injecting member 17 is shaped so that a pole-to-pole distance s against the wafer 1 becomes shorter as it goes to the central area from the peripheral portion. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
