发明名称 SEMICONDUCTOR LASER DEVICE AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor laser device which possesses excellent high-output characteristics and long-period reliability. <P>SOLUTION: The semiconductor laser device is provided with a chip 1 for CD, and a chip 2 for DVD. Further, a p-type gilding electrode 107 of the chip 1 for CD and a p-type gilding electrode 207 of the chip 2 for DVD come into contact directly without interposing solder material for adhesion. In this way, since the semiconductor laser device is not influenced by compressive strain caused by solder material for adhesion, it is prevented that a strong compressive distortion is added to the proximity of the laser luminous point 12 of the chip 1 for CD and the laser luminous point 13 of the chip 2 for DVD. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005259946(A) 申请公布日期 2005.09.22
申请号 JP20040068840 申请日期 2004.03.11
申请人 SHARP CORP 发明人 YAMAMOTO SABURO;ITO SUSUMU
分类号 G11B7/125;G11B7/22;H01S5/40 主分类号 G11B7/125
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