发明名称 ELECTRONIC COMPONENT MOUNTING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component mounting method which allows a cycle time for mounting an electronic component to be shortened by quickly and high accurately detecting the electronic component adsorbed and held to a holding member. <P>SOLUTION: In a process of transporting the electronic component b to a substrate c by adsorbing and holding it with the holding member 3 of a mounting head 2 the method mounts the electronic component b on the substrate c after a detection means 12 composed of a line-sensor camera 16 is continuously moved, and adsorbing and holding information on the electronic component b is imaged. The image pick-up of the electronic component b by the detection means 12 is performed when it is carried out by an illumination means 13. The illumination by the illumination means 13 is performed by controlling its light quantity and radiation direction to be irradiated in accordance the electronic component b mounted on the substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005260268(A) 申请公布日期 2005.09.22
申请号 JP20050129896 申请日期 2005.04.27
申请人 YAMAHA MOTOR CO LTD 发明人 OKAZAKI SHINICHI
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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