| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a component built-in board which can increase the acceptance ratio of a component bulit-in module, and a board managing system. <P>SOLUTION: Both the first component unmountable region information 112 of a first board 110 and the second component unmountable region information 122 of a second board 120 are acquired. Therefore, when an LSI 190 is mounted on the second board, the LSI is not mounted on regions corresponding to the both component unmountable regions. As a result, the wasteful consumption of the LSI can be prevented. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
