| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering jig to obtain a substrate for mounting electronic parts having high precision and high reliability. SOLUTION: There is disposed at the underside of a board body 6 a jig 5 in a soldering process for filling in a conductive layer by permitting molten solder to enter from the underside into each through hole 63 and for the electric conduction of a connecting pattern 661 and an inner lead 71. The jig 5 comprises an inside shielding member 52 located further inside of each through hole 63 of the board body 6, and an outside shielding member 51 disposed in a part surrounding the outside of the board body 6. During solder treatment, a non-contact space 81 of the molten solder is formed in a corner 8 which is formed of the outer circumferential end face of the inside shielding member 52, and an exposed part 61a sandwiched between the inside shielding member 52 at the underside of the board body 6 and each through hole 63. COPYRIGHT: (C)2005,JPO&NCIPI
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