| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component bonding method that bonds a component electrode formed on an electronic component to a substrate electrode formed on a substrate, and has high bonding reliability. SOLUTION: The electronic component bonding method bonds the substrate electrode 2 which has a surface film 3 on the surface thereof that acts as a bond inhibiting film for inhibiting bonding to the component electrode 6 formed on the substrate 1, and the component electrode 6 formed on the electric component 5. In the method, the substrate 1 is coated with a resin adhesive 4 that contains a particulate material comprising a rigid material as additive particles 4a. While the additive particles 4a are sandwiched between the substrate electrode 2 and the component electrode 6, the electronic component 5 is pressed relative to the substrate 1, thereby causing the additive particles 4a to partially break the surface film 3. Therefore, when the substrate electrode 2 and the component electrode 6 are press-contacted, new metal surfaces are caused to contact each other, thus enabling a satisfactory metal bonding surface to be secured. COPYRIGHT: (C)2005,JPO&NCIPI
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