| 摘要 |
PROBLEM TO BE SOLVED: To provide a minute sample processing/observing device and a minute sample processing/observing method, which execute cress section observation and analysis of a wafer cross section from a horizontal direction to a vertical direction without dividing the wafer used as a sample, with high resolution, high precision and high throughput. SOLUTION: This device is provided with a focused ion beam optical system and an electronic optical system in the same vacuum device, and also provided with a probe for separating a minute sample including a desired area of a sample by a charged particle beam forming process, and for extracting the separated minute sample. COPYRIGHT: (C)2005,JPO&NCIPI
|
