| 摘要 |
PROBLEM TO BE SOLVED: To provide the mounting structure of a semiconductor chip on a circuit board whose thinning is improved, and whose mounting precision is satisfactory, and to provide its mounting method. SOLUTION: In the mounting structure of a semiconductor chip on a circuit board, a first semiconductor chip 5 is configured so that a first connecting member 9 can be connected to an electrode 5b and a wiring pattern 2 arranged at one surface 1a side of the circuit board 1, in a status that a main body 5a is positioned in a through-hole 1c of the circuit board 1; and a second semiconductor chip 6 is configured so that a second connecting member 10 can be connected to an electrode 6b and a wiring pattern 3 arranged at an other side 1b side, in a status that a main body 6a is positioned in a through-hole 1c so as to be faced to the main body part 5a of the first semiconductor chip 5. Thus, the main bodies 5a and 6a can be prevented from being projected from the surface of the circuit board 1. Therefore, the circuit board 1 can be made thin in its vertical direction, and thinning can be realized. COPYRIGHT: (C)2005,JPO&NCIPI
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