| 摘要 |
Methods, devices, and systems of the invention provide improved semiconductor device testing with firm tester-to-device interface and increased contact area. A test probe ( 24, 58 ) associated with ATE ( 18 ) is configured to substantially correspond to a probe receptacle ( 38 ) of a test board ( 16 ) or semiconductor device ( 10 ). Upon insertion of the test probe ( 24, 58 ) into the probe receptacle ( 38 ), areas of staunch electrical contact ( 34 ) between the probe receptacle ( 38 ) and probe ( 24, 58 ) facilitate measuring an electrical signal.
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