| 摘要 |
To realize an area reduction of a semiconductor chip without adding a process, and to provide a semiconductor chip structure having an excellent pressure balance when mounted. In the structure of a semiconductor chip in which control/power supply lines are formed on a glass substrate, connecting terminals for electrically connecting with the control/power supply lines are provided in alignment in the longitudinal direction of the semiconductor device, whereby the wiring length within the semiconductor chip can be suppressed to be minimum. Since the wiring length is shortened, the width of the wirings within the semiconductor chip is narrowed, so that the area of the semiconductor chip is reduced.
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