发明名称 |
TWO-PACK TYPE THERMOSETTING RESIN COMPOSITION, METHOD OF FORMING COATING FILM, AND COATED ARTICLE |
摘要 |
<p>The curing time of a curable acid/epoxy type coating material is significantly reduced (especially halved) and, other performances (especially film performance) are further improved. The two-pack type thermosetting resin composition comprises: (a) an acid hydride group-containing acrylic resin which is obtained by copolymerizing an acid anhydride group-containing ethylenic monomer with an ethylenic monomer containing no acid anhydride group and has an acid anhydride group content of 0.08-5.3 mmol/g (on a solid basis) and a number average molecular weight of 500-8,000; (b) a carboxylated polyester resin which is obtained by reacting a polyester polyol having three or more hydroxy groups with an acid anhydride group-containing compound and has a carboxy content of 0.8-6.3 mmol/g (on a solid basis), a number-average molecular weight of 400-3,500, and a weight-average molecular weight/number-average molecular weight of 1.8 or lower; and (c) an acrylic resin having hydroxy and epoxy groups which is obtained by copolymerizing a hydroxylated ethylenic monomer, an epoxidized ethylenic monomer, and an ethylenic monomer having neither hydroxy group nor epoxy group and has a hydroxy content of 0.08-5.4 mmol/g (on a solid basis), an epoxy group content of 1.2-10.0 mmol/g (on a solid basis), and a number-average molecular weight of 200-10,000.</p> |
申请公布号 |
WO2005087832(A1) |
申请公布日期 |
2005.09.22 |
申请号 |
WO2005JP04347 |
申请日期 |
2005.03.11 |
申请人 |
NIPPON PAINT CO., LTD.;TANABE, HISAKI;TSUJIOKA, HIDEAKI |
发明人 |
TANABE, HISAKI;TSUJIOKA, HIDEAKI |
分类号 |
B05D7/24;B05D1/34;B05D1/36;B05D3/02;B05D5/06;B05D7/00;B05D7/14;C08F220/08;C08F220/32;C08G59/32;C08G59/40;C08G59/42;C08G63/46;C08L33/00;C08L67/00;C09D5/00;C09D7/12;C09D133/00;C09D163/00;C09D167/00;(IPC1-7):C08G59/40 |
主分类号 |
B05D7/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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