| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device excellent in long term reliability and equipped with a metal bump composed of a specific composition. <P>SOLUTION: The semiconductor device 100 includes a semiconductor chip 104, aluminum pads 106a, 106b provided on the semiconductor chip 104, alloy ball bumps 108a, 108b provided on the aluminum pads 106a, 106b and containing gold and Pd, and gold wires 110a, 110b connected with the alloy ball bumps 108a, 108b and having a surface comprising gold. The alloy ball bumps 108a, 108b contain, as a composition, gold of ≥98 mass% and ≤99.5 mass% and palladium of ≥0.5 mass% and ≤2 mass%. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
