发明名称 SOLDERING EQUIPMENT MEMBER AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To realize soldering equipment stably usable for a long time, by suppressing overall corrosion which develops all at once over a wide area of a component member in a soldering equipment using tin-enriched lead-free solder having tin as the main component and also suppressing corrosion which develops dispersively and locally. SOLUTION: In the soldering equipment in which the tin-enriched lead-free solder having tin as the main component is, in a molten state, brought into contact with a workpiece for soldering; a component member used for the equipment is formed by coating the surface of a part of the member, which comes in contact with the tin-enriched lead-free solder, successively with a substrate layer composed of silicon oxide-aluminum oxide, with a multiple oxide-film intermediate layer composed of silicon oxide, aluminum oxide, chromium oxide, and sintering aid, and with an upper layer composed of chromium phosphate chrystalline substance. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005254251(A) 申请公布日期 2005.09.22
申请号 JP20040065459 申请日期 2004.03.09
申请人 NIHON DENNETSU KEIKI CO LTD;TOCALO CO LTD 发明人 TAKEDA TOSHIO;TANI KAZUMI;TANAKA KOICHI;YOSHIZUMI TAKAYUKI;KUWANA MASANARI
分类号 B23K3/00;B23K1/08;B23K35/26;H05K3/34;(IPC1-7):B23K3/00 主分类号 B23K3/00
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