发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 <P>PROBLEM TO BE SOLVED: To reduce the cost for manufacturing a semiconductor chip having a fuse circuit. <P>SOLUTION: Through a clock pad or a data pad, a clock and data showing whether to sequentially disconnect electrical fuse circuits are supplied to a shift register. Thus, switches corresponding to the electrical fuse circuits which have to be disconnected are turned on, and the electrical fuse circuits which have to be disconnected are connected to a voltage supply line. When a high voltage is supplied to the voltage supply line via a voltage pad in this state, a current flows to the electrical fuse circuits which should be disconnected, and the electrical fuse circuits which have to be disconnected in each chip region are disconnected simultaneously. Since the clock pad, the data pad, and the voltage pad are provided to the electrical fuse circuits in each chip region in common; the size of a scribing region is reduced. Thus, the number of semiconductor chips which can be obtained from a semiconductor wafer is increased, and the cost of manufacturing the semiconductor chip is reduced. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005259890(A) 申请公布日期 2005.09.22
申请号 JP20040067646 申请日期 2004.03.10
申请人 FUJITSU LTD 发明人 ASHIZAWA TETSUO
分类号 H01L27/04;G11C7/00;H01L21/82;H01L21/822;H01L21/8242;H01L27/108 主分类号 H01L27/04
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