| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a power module capable of surely detecting a crack occurring on a solder layer above an insulation substrate by a simple manner by detecting difference in temperatures detected by means of at least one temperature sensing element provided on each of a peripheral end and at the center on a semiconductor element. <P>SOLUTION: A semiconductor device includes the semiconductor element 40 mounted on the insulation substrate via a conductive bonding layer, at least one end temperature sensing element De provided at the peripheral end of the element 40, and at least one center temperature sensing element Dc provided at the center of the element. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
